Preprints of the National Meeting of JWS
the national meeting 2007 spring
Session ID : 322
Conference information

Magnetic Pressure Welding of Copper Foils on Flexible Printed Circuit Boards
*Kenichi HanazakiTomokatsu AizawaKeigo Okagawa
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
This paper describes a new welding technique for copper foils on flexible printed circuit boards and its experimental results. When an impulse current from a capacitor bank passes through a flat one-turn coil, a magnetic flux is suddenly generated in the coil. Eddy currents are induced in two insulated aluminum sheets and overlapped copper foils on the boards between the sheets placed in the coil. The foils have a gap between them. The foils can be welded both by the Joule heat generated in them and by the impact effect with pulsed magnetic pressure applied to them. The bank energy required for this welding is about 1.0 kJ.
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© 2007 by Japan Welding Society
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