Preprints of the National Meeting of JWS
the national meeting 2007 spring
Session ID : 323
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Host: Japan Welding Society

Impact test for Sn-Ag system lead-free solder bump
*Yasunori Miki, Hiroshi Nishikawa, Tadashi Takemoto
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Keywords: lead-free solder, impact test, solder bump, Sn-Ag system
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© 2007 by Japan Welding Society
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