Preprints of the National Meeting of JWS
Preprints of the National Meeting of JWS
Session ID : 446
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Host: Japan Welding Society

Influence of Thermal Characteristics and Organic Content Using Ag Metallo-organic Nanoparticle on Bonding Strength of Cu-to-Cu joint
*Masaki Yoshida, Shinji Angata, Eiichi Ide, Toshiaki Morita, Akio Hirose, Kojiro Kobayashi
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Keywords: Ag nanoparticle, lead-free solder, sinter
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Abstract
We investigated the influence of thermal characteristics and an organic content on bonding strength using two types of Ag metallo-organic nanoparticles. It is indicated that the control of an organic content is essential to obtain the well-sintered bonding joint.
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© 2008 by Japan Welding Society
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