Preprints of the National Meeting of JWS
Preprints of the National Meeting of JWS
Session ID : 452
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Host: Japan Welding Society

Study of deterioration of mechanical characteristics of solder joint under thermal circumstance
*Yuki SHISHIHARA, Minoru EGUSA, Michiya MATSUSHIMA, Kozo FUJIMOTO
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Keywords: solder joint, thermal loading, deterioration of strength, reliability assessment
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Abstract
[in Japanese]
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© 2008 by Japan Welding Society
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