Preprints of the National Meeting of JWS
Preprints of the National Meeting of JWS
Session ID : 454
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Host: Japan Welding Society

The study on the reliability of lead-free solder joint in lead-frame interconnect structure of IGBT module
*Kyohei Fukuda, Yuuji Iizuka, Tatsuhiko Asai, Ryousei Ikeda, Tomoaki Goto
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Keywords: IGBT, lead free solder, SnAg, SnSb power cycling test
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Abstract
In this study, we have investigated the reliability of IGBT chip surface interconnection with the lead-frame structure. The heat dissipation characteristic is improved with lead-frame interconnection compared with the conventional wire interconnection. And the lead-frame interconnection with the Sn-Sb system solder has higher reliability than the Sn-Ag system.
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© 2008 by Japan Welding Society
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