Preprints of the National Meeting of JWS
Preprints of the National Meeting of JWS
Session ID : 214
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Host: Japan Welding Society

The Effect of current load on micro structure at Sn-Cu-In soldered joint
*Keiya Kaneko, Hayato Muto, Keisuke Fukushima, Yasuyuki Miyazawa, Tadashi Ariga
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Keywords: Lead-free solder, Current load, Micro structure, IMC (Intermetallic compound)
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[in Japanese]
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© 2012 by Japan Welding Society
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