Preprints of the National Meeting of JWS
Preprints of the National Meeting of JWS
Session ID : 215
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Host: Japan Welding Society

Ultrasonic bonding of dissimilar metals with complete solid solubility and its thermal reliability
*You Tanaka, Shinichi Fujiwara, Tomo Ogura, Tomokazu Sano, Akio Hirose
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Keywords: Ultrasonic Bonding, Cu/Ni bonding, Interfacial microstructure, Reliability
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Abstract
[in Japanese]
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© 2012 by Japan Welding Society
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