Preprints of the National Meeting of JWS
Preprints of the National Meeting of JWS
Session ID : 353
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Host: Japan Welding Society

Cu direct bonding for 3DIC with Sn-Ag thin film
*YOSHIHARU IWATA, NAOKI NARITA, TAKUMI SHIGEMOTO, KIYOTO YONETA, RYOHEI SATOH
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Keywords: Cu direct bonfing, 3DIC, Sn-Ag, Solid state bonding, Low temperature bonding, Low pressure bonding
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[in Japanese]
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© 2016 by Japan Welding Society
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