Preprints of the National Meeting of JWS
Preprints of the National Meeting of JWS
Session ID : 351
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Host: Japan Welding Society

Numerical analysis of the interfacial fracture of solid-state bonded interface at low temperatures
*Kittipan Pongmorakot, Shoichi Nambu, Toshihiko Koseki
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Keywords: solid-state bonding, finite element simulation
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Abstract

Cohesive Zone Model (CZM) was utilized to calculate the energy release rate during the interfacial fracture analysis of solid-state bonded interface with varying thickness of deformed layer.

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© 2017 by Japan Welding Society
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