2025 Volume 60 Issue 1 Pages 19-24
In recent years, the evolution of measurement and analysis techniques and the dramatic improvement of computational power have made it possible to obtain large amounts of complex data, and informatics methods are being actively used to extract new meaning and knowledge from these data. Our research group focuses on the integration of metrology and informatics, a field we term Metrology Informatics, with primary applications in the analysis of semiconductor materials and devices. In this paper, we present two examples from our work. The first involves applying one-sided orthogonal non-negative matrix factorization to three-dimensional scanning electron microscopy-cathodoluminescence (SEM-CL) spectral images, enabling the analysis of emission modes using statistical insights. The second example showcases a multimodal analysis approach, employing non-rigid registration methods to integrate 3D microscopy data from 3D atom probe tomography (3DAP) and electron tomography (ET), which have differing data structures.