抄録
As the amount of information communication increases, optical fiber communication devices between
servers and routers are densely integrated, and high-speed communication operations are required in
high-temperature environments. Silicon photonics, a key next-generation device, will also require
high-density integration on materials that suffer from poor heat dissipation. If such devices can operate
in high-temperature environments, that situation will be advantageous in terms of data center cooling and
power consumption. Expansion of the operating environment is also important from the viewpoint of
reliability, especially communication in space environments, underground exploration, and in-vehicle
networks. Each author described the causes of property deterioration in high-temperature environments
and offered suggestions for improving the structure, materials, and properties for overcoming this problem.
