Adhesion of Electrodeposited Copper, Nickel and Silver Films on Copper, Nickel and Silver Substrates
2004 年 45 巻 12 号 p. 3330-3333
詳細
2004 年 45 巻 12 号 p. 3330-3333
The adhesion of electrodeposited Cu, Ni and Ag films on Cu, Ni and Ag substrates has been examined by the adhesion tape test. Different interfacial structures have been observed by SEM, GD-OES and TEM for the different film/substrate combinations and have been discussed in relation to the interface adhesion. Results show that the different combinations of the electrodeposited films and substrates reveal the different interface adhesive feature. Typically a strong adhesion presents in the interfaces of Ni film/Cu substrate, while a weak adhesion presents in the interfaces of Cu film/Ni substrate, Cu film/Ag substrates, Ni film/Ag substrate, Ag film/Ni substrate as well as Ag film/Cu substrate. The crystallographic coherency existing in the interface of Cu deposited film/Ni substrate suggests that the adhesion of electrodeposited films on various metal substrates is primarily determined by the crystallographic coherency rather than by the effect of voids in the interfaces.
