Elastic Properties of Sn-Based Pb-Free Solder Alloys Determined by Ultrasonic Pulse Echo Method
2005 年 46 巻 6 号 p. 1271-1273
詳細
2005 年 46 巻 6 号 p. 1271-1273
The Young’s modulus (E) and Poisson’s ratio (ν) of Sn-based lead-free solders as Sn–3.5Ag, Sn–58Bi and Sn–9Zn (compositions in mass%) were measured at various temperatures between −50 and 100°C using an ultrasonic pulse echo method. The values of Young’s modulus and Poisson’s ratio were obtained at 25°C. These values coincide with the room temperature values in the literature. The Young’s modulus and Poisson’s ratio between −50 and 100°C were also measured for Sn–58Bi, Sn–9Zn, and Sn–37Pb.
