2005 年 46 巻 6 号 p. 1413-1416
The interconnections among thin film transistor liquid crystal displays (TFT-LCDs) are laid on the films, made by the spotted coating method. This work studies the effect of heat-treatment, at temperatures from 523 K to 673 K, on the microstructure and physical properties of the deposited alloy thin films. The experimental results imply that, following heat treatment, the roughness of the aluminum-scandium (Al-Sc) alloy film is less than that of the aluminum-neodymium (Al-Nd) alloy, and the hillocks of the Al-Sc alloy film are lower. Accordingly, components are predicted to fail less often. The resistivity of the Al-Sc thin film is less than that of the Al-Nd thin film before it is thermally treated. Heat treatment reduces the resistivity of both, even though the reduced resistivity of Al-Nd exceeds the resistivity of the Al-Sc alloy film. Restated, the resistivity of the thermally stable Al-Sc thin film exceeds that of the Al-Nd thin film. Experimental results imply that the Al-Sc alloy is the more effective for making the driving circuit wires in the TFT-LCDs.
