2007 年 48 巻 2 号 p. 148-150
Interfacial thermal resistance is an important factor that has a considerable effect on the thermal conductivity of composites, especially nanocomposites, and must therefore be considered when developing new composites for various structural and nonstructural applications. However, reported data on interfacial thermal resistance are sparse as a result of a lack of efficient measurement methods. We developed a new analytical and measurement method for the determination of the interfacial thermal resistance between a metal and a dielectric material by using a technique involving periodic Joule (ohmic) heating and thermo-reflectance. The principle is based on a one-dimensional model of heat conduction in a two-layered system, taking into account the interfacial thermal resistance. By using this method, the interfacial thermal resistances between Au films and substrates of SiO2 glass or sapphire single crystal were measured. The results were compared with values calculated by the diffusion mismatch model, and the experimental factors that might affect the interfacial thermal resistance are discussed.
