2007 年 48 巻 6 号 p. 1554-1557
ATR-FTIR apparatus is used to measure the curing rate of PMDA-ODA polyimide film in order to avoid sinusoidal interference fringe. From the corrected height method, the curing rate is found to have positive correlative trend with the curing temperature. It was shown that the curing rate under 300 °C is 92.1% than that under 400 °C for one hour. The curing degree related to the mechanical properties was further demonstrated by nanoindentation. The results show that the higher the curing rate the higher the nano-hardness and nano-modulus due to the thermal imidization of polyimide characteristic. The nano-hardness ratio of curing degree at 300 °C over curing degree at 400 °C is 0.89, while the nano-modulus of which is 0.95.
