MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Solid State Bonding of Carbon Material to Copper with Nickel Insert
Hidekazu SueyoshiHisayoshi Fukudome
著者情報
ジャーナル フリー

2008 年 49 巻 9 号 p. 2063-2067

詳細
抄録
Carbon material/nickel/copper system was heated under a compressive stress of 13 MPa in a vacuum at 1073 K for different keeping times, and the bending strength of the joint, the microstructure, hardness and carbon concentration near the joining interface were examined. Thermal stress induced in the joint was estimated by a finite element method. In carbon material/copper system solid state bonding is difficult. However, good solid state bonding becomes feasible when nickel is used as an insert metal. Axisymmetric thermoelastic finite element analysis reveals that the maximum tensile thermal stress is induced on the surface of carbon material near the joining interface, and it decreases with increasing nickel thickness. The maximum residual tensile thermal stress in practical joints is less than the maximum tensile thermal stress calculated by finite element method because the thermal stress is released.
著者関連情報
© 2008 The Japan Society for Heat Treatment
前の記事 次の記事
feedback
Top