2010 年 51 巻 9 号 p. 1614-1620
In this study, a cellular automata technique was developed to simulate a dynamic recrystallization process of pure copper. Moore’s neighboring rule was applied with partial fraction and time step control in the current approach to represent the grain growth kinetics more accurately. The cellular automata model developed in this study was applied to a simulation of the dynamic recrystallization of pure copper during hot deformation and compared with the experimental flow stresses and grain sizes determined from hot compression tests for validation. The predicted results were in reasonably good agreement with the experimental results. The grain coarsening and refinement phenomena were also investigated in detail. Finally, the effects of the process parameters on the microstructure and flow stress were investigated from various simulation results.
