Mechanism of Low Temperature Sintering-Bonding through In-Situ Formation of Silver Nanoparticles Using Silver Oxide Microparticles

抄録

In this paper, a low temperature sintering-bonding process through in-situ formation of silver (Ag) nanoparticles using silver–oxide (Ag₂O) microparticles was studied. The Ag₂O powders were mixed with triethylene glycol (TEG) to form a paste, which was used to bond the Ag-coated copper (Cu) bulks. The results revealed that high temperature was helpful to increase the bond strength, and the joints average shear strength can reach 21.9 MPa at 523 K under 2 MPa for 5 min. And the mechanism of the reaction and sintering bonding process were basically made clear by using TGA-FTIR, FE-SEM and XRD, further, a reasonable sintering-bonding model was proposed.