Influences of Residual Stress Induced by Cutting on Subsequent Scratch Using Smooth Particle Hydrodynamic (SPH)

抄録

A smooth particle hydrodynamic (SPH)-based scratch model was proposed to study the influences of residual stress induced by the first cutting on subsequent scratch. In this paper, comparisons were made between the results of only scratching the specimen and those of subsequent scratching the specimen after cutting under different scratch depths. Chip formation, scratching forces and residual stress in scratching-induced subsurface were recorded on oxygen-free high-conductivity copper (OFHC) during the simulations. Simulation results indicated that the first cutting produced work hardening in the subsurface of the specimen and the increased hardness led to a thinner and more curled chip. Meanwhile, the minimum chip thickness also decreased because of residual stress induced by cutting. Moreover, it also resulted in high resistance during the subsequent scratch so that the scratched surface presented flat. However, the material on both the sides of the groove bulged in Scratch model. Therefore, scratch after cutting is beneficial to obtain scratched surface with high quality.