MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Effect of Roll-Bonding and Subsequent Annealing on Microstructure Evolution of Accumulative Roll Bonded Pure Copper
Yoji MiyajimaMidori UchiyamaHiroki AdachiToshiyuki FujiiSusumu OnakaMasaharu Kato
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2016 年 57 巻 9 号 p. 1411-1417

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The microstructure and texture evolution of an accumulative roll bonding (ARB) processed 4N-Cu with and without lubrication were compared in addition to the mechanical properties, in order to understand the effect of additional shear strain caused by the friction between the rolls and a sheet. Furthermore, subsequent annealing at 423 K, 448 K and 473 K was applied for 4N-Cu ARB processed with and without lubrication, and, softening was observed for all temperatures. The texture change due to the ARB process and subsequent annealing were discussed using {111} pole figures and ODF maps. As a result, a 45° rotated Cube texture around ND was formed by additional shear strain, whereas the typical fcc rolling texture was formed by ARB with lubrication. At higher ARB cycles of 4N-Cu, discontinuous recrystallization occurs due to its medium stacking fault energy. Cube orientation appeared in annealed-ARB processed 4N-Cu with lubrication, whereas no specific texture appeared in annealed-ARB processed 4N-Cu without lubrication

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© 2016 The Japan Institute of Metals and Materials
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