論文ID: MT-MC2022002
In the present study, plating films with three-dimensional structures were formed by using a plating bath mixed with Cu sulfate and Ni amidosulfate. Furthermore, the effect of the shape of plating films, which was changed by plating at different potentials, on the adhesive force with epoxy resin was investigated. The results show that when the ratio of the concentration of Ni amidosulfate to that of Cu sulfate was 150:15 (g/L) and the potential was set to −1.0 V to −2.0 V, dendritic plating films were formed. The average peak shear force of the specimen joined with epoxy resin between two Cu plates with the dendritic plating films formed at the potential of −1.5 V, was 180.1 N. The dendritic plating films had higher adhesive force than the smooth plating film through the anchoring effect.
