Effect of Working Temperatures on Recrystallization Behavior of Ni-30%Cu Alloy

Abstract

The effect of working temperatures on the recrystallization behavior of Ni-30%Cu alloy was investigated by Vickers hardness measurements, light microscopy and transmission electron microscopy. As the working temperature raised, the beginning of recrystallization was retarded and the grain size of a recrystallized structure became finer. However, the activation energy for recrystallization was not affected so much by the working temperature, except for a somewhat high activation energy in the specimen annealed from the cold worked state.
Transmission electron microscopy revealed that the dislocation cell structures were developed by working at a higher temperature and they seemed more stable compared with uniform dislocation structures in the cold worked specimens. These results suggest that the fine grain structure obtained by isothermal annealing after warm working can be attributed to the dislocation structures which consisted of stable cells.