Abstract
X-ray diffraction, differential scanning calorimetry and electrical resistivity measurements have been performed on sputter-deposited T1−xPdx alloys. An amorphous phase is obtained for 0.3<x<0.5 on water-cooled substrates and for 0.2<x<0.6 on liquid-nitrogen-cooled substrates, while the bcc phase (β-Ti) and the fcc phase are obtained for both Ti-rich and Pd-rich concentration regions. The crystallization temperature of amorphous alloys is about 700 K, being insensitive to x. With increasing x, the residual resistivity increases for x<0.2 (in the bcc phase), reveals a maximum of about 3 μΩ·m for 0.3<x<0.5 (in the amorphous phase) and decreases for x>0.7 (in the fcc phase). With increasing temperature, the resistivity increases in the bcc alloys with x<0.1 and the fcc alloys with x>0.8, while it decreases in the bcc alloys with x>0.1 and all of the amorphous alloys.
