Materials Transactions, JIM
Online ISSN : 2432-471X
Print ISSN : 0916-1821
ISSN-L : 0916-1821
Effect of Grain Boundary Sliding on the Creep Micro-Deformation of Copper
R. A. CarolanM. EgashiraS. KishimotoN. Shinya
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1991 Volume 32 Issue 1 Pages 67-73

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Abstract
Grain boundary deformation measured using the electron lithographic microgrid technique has been found to give rise to regions of compressive longitudinal strain as well as strain concentrations in a uniaxial tensile creep test. The complexity of the experimental strain distribution is better explained by the use of a multi-grained finite element model of the creep process; that can allow for variations in the grain boundary viscosity.
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© The Japan Institute of Metals
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