1996 年 37 巻 9 号 p. 1505-1510
The aim of this study is first to find suitable bonding conditions for joining Ni-base single crystal superalloy TMS-26 without the formation of a recrystallized zone at bond-line. Subsequently the study is carried out to investigate the relationship between misorientation angle at bonding interface and joint strength. Joints were made using samples prepared with a {100} crystal plane at the bonding surface. All the samples were joined in a vacuum of 4×10−3 Pa using radio frequency heating.
Single crystal TMS-26 can be bonded without the formation of voids and recrystallized zone at the bond-line. The quality of creep rupture of joints deteriorates due to formation of precipitates at the bond-line. There are a few inclusions at the bond-line when the twist angles of 0° up to 3° are used. Creep rupture life of the joints is long. When twist angles greater than 3° are used, many inclusions are formed at the bond-line and joint strengths are very low. The precipitates at the bond-line consist of α tungsten phase and oxides due to surface film.
