Fabrication of Ti/Ti₅Si₃ Functionally Graded Material by Eutectic Bonding Method

Abstract

Ti/Ti₅Si₃ functionally graded material was fabricated by a eutectic bonding method. A metal Ti and an intermetallic compound Ti₅Si₃ were bonded by utilizing a eutectic reaction, where Ti₅Si₃ was chosen because of its high heat resistance and high oxidation one. In the case of bonding the stoichiometric Ti₅Si₃ with the pure Ti, cracks were formed within the Ti₅Si₃ part. Since the cracking was suspected to occur due to the low ductility of the stoichiometric Ti₅Si₃, a Ti-rich Ti₅Si₃ which is ductiler than the stoichiometric Ti₅Si₃ was applied in place of the stoichiometric Ti₅Si₃. As a result, a sound FGM without any detectable defects was realized.