MES2008
Conference information
Host: Japan Institute of Electronics Packaging
MES2008
Chemical Flip-chip Bonding using Electroless Plating (II) -Application to Finer Pitch Face-down Bonding-
*[in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
Author information
Pages 1B2-2-
Details
Article 1st page
