Proceedings of Microelectronics Symposium

Low Profile Broadband Circularly-Polarized Patch Antenna Using Metamaterial [in Japanese], [in Japanese]
Electromigration in Cu/Sn-5Sb/Ni-P/Al Solder Joints in Power Modules [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
Printable Sheet Sensor in Micropower Organic Circuit [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
Evaluation of clap-hand-bending fatigue of pentacene based organic thin-film transistors [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]

Most viewed articles (May 2025)

1

Cu/Dielectric Hybrid Bonding by Using Combined Surface Activated Bonding Method

Released on J-STAGE: November 29, 2019 | MES2016 Pages 299-302
2

Development of 2.5D type high density organic package substrate

Released on J-STAGE: October 18, 2019 | MES2018 Pages 293-296
3

Influence of Crystallographic Structure on Etching Rate of Copper by use of Sulfuric Acid/Hydrogen Peroxide Solution

Released on J-STAGE: August 12, 2020 | MES2012 Pages 83-86
4

The Latest Developments of the Power Device Package to Support The Power Electronics

Released on J-STAGE: November 29, 2019 | MES2016 Pages 15-22
5

High Reliability Mold-Underfill Material and Encapsulation Process for SIP

Released on J-STAGE: April 30, 2021 | MES2011 Pages 157-160

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