Cu/Dielectric Hybrid Bonding by Using Combined Surface Activated Bonding Method

Released on J-STAGE: November 29, 2019 | MES2016 Pages 299-302

Package and Assembly Technologies fir Power Semiconductor Modules

Released on J-STAGE: August 12, 2020 | MES2013 Pages 137-142

The way of Reliability Evaluation to think from Deterioration Phenomemon by Electrochemical Miglation

Released on J-STAGE: November 29, 2019 | MES2017 Pages 205-210

Novel Low-temperature Curable Positive-Tone Photosensitive Polyimide Materials with High Elongation

Released on J-STAGE: November 29, 2019 | MES2017 Pages 131-134

Optimization of Electrochemical Properties of Binder to Design in a Silicon Anode for Lithium-ion Battery.

Released on J-STAGE: November 29, 2019 | MES2017 Pages 255-258