Proceedings of Microelectronics Symposium

Proceedings of Microelectronics Symposium

Published by The Japan Institute of Electronics Packaging

1,326 registered articles
(updated on November 11, 2025)

Online ISSN : 2434-396X

CONFERENCE PROCEEDINGS FREE ACCESS

Fabrication Process of a 3D IC with Backside Buried MetalPower Delivery Network [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
Thermaland Mechanical Reliability and Crack Propagation Mechanism in CuO Nanoparticles Contained Ag Sintering Die Attach Assemblies [in Japanese], [in Japanese]
Feasibility Study on Crosstalk Suppression Technology by Using Lossy Transmission Line with Periodic Structure for Interposer Applications [in Japanese]
TLM Evaluation of Impact of Contact Resistance in Electronic Characteristic Changes of Organic Thin-Film Transistors under Bending Lord [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]

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Most viewed articles (October 2025)

1

Cu/Dielectric Hybrid Bonding by Using Combined Surface Activated Bonding Method

Released on J-STAGE: November 29, 2019 | MES2016 Pages 299-302
2

Novel Low-temperature Curable Positive-Tone Photosensitive Polyimide Materials with High Elongation

Released on J-STAGE: November 29, 2019 | MES2017 Pages 131-134
3

Effect of Third Element Alloying to Sn-Bi

Released on J-STAGE: April 30, 2021 | MES2008
4

[title in Japanese]

Released on J-STAGE: September 01, 2023 | MES2021 22A4-2
5

Development of 2.5D type high density organic package substrate

Released on J-STAGE: October 18, 2019 | MES2018 Pages 293-296

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