Cu/Dielectric Hybrid Bonding by Using Combined Surface Activated Bonding Method

Released on J-STAGE: November 29, 2019 | MES2016 Pages 299-302

The Latest Developments of the Power Device Package to Support The Power Electronics

Released on J-STAGE: November 29, 2019 | MES2016 Pages 15-22

Compression molding technology to FO-WLP devices

Released on J-STAGE: November 29, 2019 | MES2017 Pages 427-428

Package and Assembly Technologies fir Power Semiconductor Modules

Released on J-STAGE: August 12, 2020 | MES2013 Pages 137-142

High Reliability Mold-Underfill Material and Encapsulation Process for SIP

Released on J-STAGE: April 30, 2021 | MES2011 Pages 157-160