Cu/Dielectric Hybrid Bonding by Using Combined Surface Activated Bonding Method

Released on J-STAGE: November 29, 2019 | MES2016 Pages 299-302

Bump Structure Study for Fine Pitch Flip Chip Interconnection

Released on J-STAGE: August 12, 2020 | MES2012 Pages 47-50

Compression molding technology to FO-WLP devices

Released on J-STAGE: November 29, 2019 | MES2017 Pages 427-428

The Latest Developments of the Power Device Package to Support The Power Electronics

Released on J-STAGE: November 29, 2019 | MES2016 Pages 15-22

Experiments of A New Visual Inspection Method by Combining KIZKI Processing and Convolutional Neural Network

Released on J-STAGE: November 29, 2019 | MES2017 Pages 363-366