Cu/Dielectric Hybrid Bonding by Using Combined Surface Activated Bonding Method

Released on J-STAGE: November 29, 2019 | MES2016 Pages 299-302

The Latest Developments of the Power Device Package to Support The Power Electronics

Released on J-STAGE: November 29, 2019 | MES2016 Pages 15-22

Novel Low-temperature Curable Positive-Tone Photosensitive Polyimide Materials with High Elongation

Released on J-STAGE: November 29, 2019 | MES2017 Pages 131-134

Development of aluminum nitride substrate for high power device

Released on J-STAGE: August 12, 2020 | MES2012 Pages 29-30

Package and Assembly Technologies fir Power Semiconductor Modules

Released on J-STAGE: August 12, 2020 | MES2013 Pages 137-142