Proceedings of Microelectronics Symposium
Online ISSN : 2434-396X
MES2022
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Host: Japan Institute of Electronics Packaging

MES2022
Improvement of the adhesion strength between electro-less copper plated layer and resin substrate for high frequency applications using a 172 nm Xe2* excimer lamp
*[in Japanese], [in Japanese], [in Japanese]
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CONFERENCE PROCEEDINGS FREE ACCESS

Pages 43-46

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