Proceedings of Microelectronics Symposium
Online ISSN : 2434-396X
MES2023
Session ID : 8A2-3
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Host: Japan Institute of Electronics Packaging

MES2023
Effect of Storage Temperature on Adhesion to Mold Underfill Resin of Polyimide Film Treated with Plasma Surface Modification
*[in Japanese], [in Japanese], [in Japanese]
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