Proceedings of Microelectronics Symposium
Online ISSN : 2434-396X
MES2024
Session ID : 13D3-2
Conference information

MES2024
Development of Package Substrate with Optical Waveguide for CPO
*[in Japanese], [in Japanese]
Author information
CONFERENCE PROCEEDINGS RESTRICTED ACCESS

Details
Article 1st page
Content from these authors
© 2024 The Japan Institute of Electronics Packaging
Previous article Next article
feedback
Top