2018 Volume 39 Issue 2 Pages 63-72
We recently proposed a new type of metal-resin bonding technique using monolithic epoxy with bicontinuous and porous structures. In this study, we optimized thermal curing conditions for the fabrication of epoxy monolith using 2,2-bis(4’-glycidyloxyphenyl)-propane as the diepoxy material with nine kinds of aromatic diamines as the crosslinkers and polyethylene glycol and polypropylene glycol as the porogens. We evaluated bonding strength values by lap-shear tensile measurement for dissimilar materials bonding systems of monolith-modified stainless steel and aluminum plates, on which a polycarbonate plate was heat-welded at 200-250 ℃.