2021 Volume 42 Issue 5 Pages 194-200
The physical properties of the crystalline cured polymer obtained by the reaction of the epoxy resin (DGBZP) having a benzophenone structure with 4,4'-dihydroxybenzophenone (DHBZP) were evaluated. The melting point (Tm) of the DGBZPcured product was 234.6℃, which was 56.7℃ higher than that of the epoxy resin (DGDPE) having a diphenylene ether structure, and Tg was also 43.3℃ higher than that of DGDPE. The coefficient of linear thermal expansion was 4.2 × 10-5 ℃ -1, which was significantly reduced by crystallization. Furthermore, it was confirmed that the thermal diffusivity had higher value up to around 230℃, corresponding to the Tm.
