2023 Volume 44 Issue 1 Pages 3-10
To prepare for the application of communication standard of 5G and the upcoming 6G, internet data center (DC) as a core of the cloud computing is built more, and many edge servers are used for the communication with the terminal equipment such as smartphone and personal computer. These electronic equipments have been developed in the direction further large-capacity data processing in real time. In these electronics equipment, state-of-the-art semiconductor chips with 5 nm wiring rule are used. In addition, the high-density LSI packaging technologies including high performance network polymers play a very important role. I clarified material characteristics required for multilayered wiring board, package substrate, redistribution layer (RDL) of interposer and mold resin, respectively. Moreover, I explained recent technology and trend about the network polymer which had low dielectric properties to be required from the viewpoint of high frequency and high-speed signal transmission.
