Development of Active-ester Type Epoxy Resin Curing Agents and its Practical Application to the Printed Wiring Boards of High-Speed Communication Devices.

Abstract

In the development of epoxy materials for the printed wiring boards of high-speed communication devices, we have developed a curing agent with a low dielectric constant and low dielectric loss tangent. By developing the basic technology of the active-ester type epoxy resin curing agent announced, we have succeeded in developing a new polyfunctional oligomer type active-ester type epoxy resin curing agent which can be used as a material for electronics. Compared with the widely used phenol novolac curing system, a significantly lower dielectric constant and lower dielectric loss tangent have been achieved whilst maintaining a high glass transition temperature. It is considered that the centrally-located dicyclopentadiene skeleton exhibits an excellent low dielectric constant and low dielectric dissipation factor whilst maintaining heat resistance due to its rigidity, small molar polarisability and large molar volume.