Development of novel crosslinking type polyphenylene ether prepolymers (VS-PPE) and its resin composition for multilayer laminates in the next generation high-speed communications

Abstract

A novel crosslinking type polyphenylene ether prepolymers (VS-970) with a low dielectric loss tangent (D_f) value was synthesized and was evaluated for multilayer laminate applications in high-speed communication field. VS-970 single cured product showed low D_f value and high T_g, and its curing mechanism was analyzed. VS-970 exhibits excellent compatibility with hydrogenated styrene-butadiene block copolymer (SEBS), which has an extremely low D_f value and has the capability to formulate a uniform curable resin composition without a compatibilizer causing increase of the D_f value. As a result, the cured product of VS-970/SEBS showed a quite low D_f value (0.0029@10 GHz). A phenomenon was observed in which the D_f value of the cured product varied greatly depending on the structural ratio of the SEBS, and this was found to be due to the difference in the phase separation structure of the cured product formed.