Quantitative analysis of Free Bisphenol A in Latent Curing Agents for Epoxy Resins by LC-MS/MS

Abstract

We investigated a simple and highly sensitive analytical method for free bisphenol A (BPA) in latent curing agents for epoxy resins using a high-performance liquid chromatography-tandem mass spectrometry (LC-MS/MS) system. The mobile phase for high-performance liquid chromatography (HPLC) consisted of a 0.01% acetic acid aqueous solution and acetonitrile, and the column used was an L-column3 C18 (2.1×150 mm, 3 μm). The ionization mode for MS/MS was negative electrospray ionization (ESI), and the multiple reaction monitoring (MRM) transition was set at m/z 227－133. N, N-dimethylformamide (DMF) was used as the sample solvent because it is miscible with both the sample and the mobile phase. Quantification was performed using the internal standard method and the standard addition method, and equivalent quantification values were obtained. This indicates that the measurement was not affected by impurities. The results demonstrate that this method can be used for the simple and highly sensitive quantification of free BPA in latent curing agents.