Abstract
SynopsisCresol formaldehyde novolac resins (Cre/Form) having hard properties cannot be applied minutely the positivetype photoresist material onto dry fi lms. Therefore, a new development was needed, so we carried out the synthesis and application of cresol novolac resins having fl exibility. The polycondensation reactions with cresols(Cre) and glutaraldehyde(Glu) were carried to obtain cresol glutaraldehyde novolac resins(Cre/Glu). Cre/Glu having both a dissolving rate foralkaline aq. solution below 1000Å/s and Mw over 2000 were chosen for the test. The 5μm thick cast fi lms of Cre/Glu were applied onto polyimide fi lms in order to evaluate the fl exibility properties of the obtained resins by observation of their bent parts. Though the Cre/Form resin of the bent part was scattered, the Cre/Glu resin was settled with just cracks. The fl exibility of the Cre/Glu resin was also confi rmed from the results of the dynamic storage modulus measurement, too. The lithography performance of the Cre/Glu resin coated 1.5μm in thickness onto the silicon wafers was examined. The residual membrane thickness was high (98%) and the resolution of the resist was up to 2.5μm.
