Journal of Network Polymer,Japan
Online ISSN : 2186-537X
Print ISSN : 1342-0577
ISSN-L : 1342-0577
Original
New Production Process and Properties of Phenolic Resin/Copper Nanoparticle Composite
Akihiro MATSUMOTO,Keiko OHTSUKAHajime KIMURAMasayoshi YOSHITAKENobuyuki ITOH
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JOURNAL FREE ACCESS

2011 Volume 32 Issue 3 Pages 154-159

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Abstract

SynopsisCopper nanoparticle was produced from copper(II) hydroxide by chemical reduction using hydrazine in resol methanol solution. The characteristic of this process was as follows; (ⅰ) the surface of copper nanoparticle was coated by phenolic resin as soon as copper nanoparticle was produced, (ⅱ) oxidation or cohesion of copper nanoparticle scarcely happened, and (ⅲ) copper nanoparticle was nighly fi lled up in phenolic resin with nanoscale dispersion. As the content of copper was increased, the volume resistivity of the ink produced with copper nanoparticle dispersion was lowered. The volume resistivity of the printed ink consisting of 9wt% phenolic resin and 91wt% copper nanoparticle was low and closet those of copper foil for printed wiring.

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© 2011 Japan Thermosetting Plastics Industry Association
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