Abstract
SynopsisThe conventional thermosetting resins have low thermal conductivities because of phonon scattering in their amorphous structures. Therefore, it is important to improve the thermal conductivity by suppressing phonon scattering, such as controlling the high-order structures or increasing the crosslink densities. In this paper, we investigated the correlation between three thermophysical parameters and the thermal conductivity, and the effectiveness of the high order structure and crosslink density. As a result, it was found that the thermal conductivity is correlated with and controlled by the thermal diffusivity. Then, the effects on the thermal conductivity of the high-order structures and the crosslink densities were investigated. The results revealed that the thermal conductivities of the resins having the mesogen groups were 1.5－4times higher than those of conventional ones with same crosslink densities. Additionally, higher thermal conductivity was obtained from higher domain-area ratio of high-order structures. In contrast, the increase in the thermal conductivities of the conventional resins by the crosslink density was slight, suggesting that to enhance the thermal conductivity, the formation of the highly ordered structure by mesogen is much more effective than the crosslink density.
