Journal of Network Polymer,Japan
Online ISSN : 2186-537X
Print ISSN : 1342-0577
ISSN-L : 1342-0577
Original
Thermal and Mechanical Properties of Epoxy Curable Solvent Soluble Imide Resins/Clay Nanocomposites
Takashi MIHARAEiju ICHINOSE
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2011 Volume 32 Issue 6 Pages 332-338

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Abstract
SynopsisWe investigated the properties of the cured films prepared from various inorganic materials dispersed in solvent soluble imide resins containing carboxyl group at the end of the epoxy resins. It turned out that layered type inorganic materials are more effective. The thermal properties of the epoxy resin curable films, which were obtained from nanocomposites synthesized by solvent soluble imide resin in the presence of organoclay via an intercalation technique, have dramatically improved as compared with conventional solvent soluble imide resin.
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© 2011 Japan Thermosetting Plastics Industry Association
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