Abstract
BT Resin is an additional polymerization type heat resistant thermosetting resin, developed by Mitsubishi Gas Chemical Company in 1974. It is produced through thermal polymerization of Triazine resin, which was developed by Bayer AG of West Germany, with bismaleimide. BT Resin, having imide rings in its molecule, falls under the category of polyimide resin. In addition to its high heat and abrasion resistance, good electrical properties, such as low dielectric constant and migration resistance, this resin is also excellent in moldability, workability, reactivity and low toxicity, making it a unique high performance material of highly practical nature. With its attractive characteristics highly evaluated among users of the resin at home and abroad, BT Resin now finds a wide range of applications in the making of printed circuits for electronic equipments, structural material for aircrafts, insulation material for heavy electric equipments, powder coating, molding material, protective coating material for electronics parts, etc. This paper outlines the reactivity of the cyanate groups of BT Resin as a functional material, process for the manufacture of the resin, performance and properties of the resin and current development of its applications.
