Abstract
We studied the cause of failures in wire bonding on IC assembly process with conductive silver-filled epoxy adhesives.
We examined that the relationship between curing temperature and wire bonding strength, the relationship between the amount of curing agent and wire bonding strength, and component of gases on curing conductive adhesives. Consequently, we presumed two reasons of failures in wire bonding.
Namely, the one is that the aluminum bonding pads are contaminated by high boiling gases issued from conductive adhesives. The other is that aluminum bonding pads are transmuted by ammonia issued from conductive adhesives.
