Abstract
Epoxy resins are widely utilized as molding compounds for electronic devices. The progress of surface mount technology in this industrial field would require the development of higher performance epoxy resins. Here, the synthesis and characterization of the mesogenic epoxy resins and the epoxy/silica hybrid materials are overviewed with emphasis placed on the network chain motion-property relationship. The introduction of mesogenic groups into epoxy networks is effective for improving the toughness and heat resistance, and the hybrization with silica network could improve the mechanical and adhesive bonding properties of cured epoxy resins in the high temperature region.
