The 48th National Heat Transfer Symposium
Session ID : F124
Conference information
Host: The Heat Transfer Society of Japan
F12 OS Thermal Design and Cooling Technology Supporting Reliability of Electronic Equipment 2
Thermal Conductivity Measuring Method of Flat Plates such as Printed Wiring Boards (2)
Experimental Results of Flat Plate Thermal Conductivity by Fin Temperaure Fitting Method
Details
