電子デバイス製造のための微細印刷技術

抄録

With the advancement of nanomaterials and process technologies, the application fields of printed electronics have broadened. In this paper, high-resolution printing methods such as reverse offset printing and adhesion contrast planography are reviewed. In the first part, the rheology of semidry states required to achieve a single-micrometer feature by these printing methods is discussed. Together with simulations of the patterning process, the importance of elasticity and plasticity exhibited by the semidried ink layer is highlighted. By utilizing semidried ink characteristics, it is also possible to bury the conductive layer in a dielectric layer, which can significantly reduce the risk of step-coverage problems, thus making it beneficial for creating multilayered structures. In the latter part of the review, the deformation behavior of silicone rubber blankets, one of the key components in high-resolution printing, is presented. It is shown that blanket deformation has a particular peak in the vicinity of the pressed area when the blanket has a finite thickness. By optimizing the blanket structure based on contact mechanics, vertical interconnections through conformal vias can successfully be formed. A quantitative analysis on registration accuracy in relation to processing parameters such as printing pressure, tilting of roll, and the synchronization mismatch between roll and table is also presented to realize high-precision, high-resolution printed electronics.