フィルム上に形成された金属パターンの転写システム
1995 年 32 巻 4 号 p. 215-222
詳細
1995 年 32 巻 4 号 p. 215-222
Process for manufacturing the printed circuit boards is described. The steps of this process is as follows: PET film substrate with undercoated layer which adsorbed Pd/Sn colloidal nuclei by dipping treatment is electroless copper plated and pattern electroplated using photolithography; this metal pattern on the film substrate is transfered by peel apart method to the insulating substrate using adhesive layer. This process is promising in the field of automatic assembling of high density, especialy multilayer printed circuit boards. And in this paper, mecahnisms of the formation of black copper layer and transfer process by peel apart are discussed.
