Large Size of Real-Time Bi₁₂SiO₂₀ Hologram Device Made with Inexpensive Wafer Cutting Method

抄録

The large real-time hologram device made by the previous Bi₁₂SiO₂₀ single crystal wafer cutting method poses several problems such as a large residue of material hinders the practical use. A study was carried out to fabricate a real-time hologram device using inexpensive laterally cut circular (1 0 0) Bi₁₂SiO₂₀ single crystal wafers which would be suitable for practical use for 3-dimensional display. An angle incident on a (1 0 0) wafer is applicable to the real-time hologram. An optimal electrode design for a device with uniform diffraction efficiency was considered, and the device properties were experimentally investigated.