2012 Volume 81 Issue 9 Pages 765-768
Recently, the applications of MEMS devices fabricated using piezoelectric films have widely been extended to inkjet-printer heads and angular-rate sensors. Most of the piezoelectric films used in the present products are Pb (Zr,Ti)O3 films with a high fraction of lead (Pb), and it is seen as an environmental problem. However, there has been no report regarding high-performance lead-free piezoelectric films that are sufficient for substituting Pb (Zr,Ti)O3 films. Under these circumstances, we developed technologies for preparing fine (K,Na)NbO3 films with (001) orientation deposited by sputtering and successfully obtained a high piezoelectric coefficient d31 of more than 100 pm/V on 4-inch Si wafers. The d31 value was comparable to those of the best commercially available Pb(Zr,Ti)O3 films.